Bangalore based izmo Microsystems Pvt Ltd, the semiconductor arm of IZMO Limited, has achieved a significant milestone by developing and manufacturing an indigenous high-frequency RF Quad Flat No-Lead semiconductor package capable of operating at frequencies up to 40 GHz.

This package was created for a customer working on advanced RF modules intended for defence and secure wireless communication applications. Following successful assembly and electrical validation, the company has commenced production shipments, with manufacturing processes already established to support higher volumes as demand grows.

This achievement strengthens izmo Microsystems’ expertise in advanced RF and microwave semiconductor packaging. It demonstrates the company’s ability to design application-specific packages and take them seamlessly from concept and fabrication through assembly, validation, and commercial production.

The development highlights India’s growing capacity in semiconductor packaging for defence and strategic communication systems.

High-frequency semiconductor devices face mounting challenges as operating frequencies rise. Conventional moulded and open-cavity QFN packages often encounter performance limitations due to package parasitic.

To overcome these issues, izmo Microsystems engineered a package architecture with optimised trace geometry and precise die positioning. The design achieves wire bond lengths of approximately 0.3 mm and incorporates a precision air cavity around the die. This architecture reduces parasitic effects and ensures reliable operation at frequencies up to 40 GHz.

The technology has wide-ranging applications in radar, electronic warfare, secure communications, aerospace, satellite communications, and advanced wireless systems. These domains demand semiconductor components capable of reliable high-frequency performance, making this innovation strategically important.

The development also aligns with India’s increasing emphasis on domestic semiconductor and defence electronics capabilities. Rising defence requirements, indigenous procurement priorities, and the strategic need for secure communications are driving demand for locally developed technologies.

Dinanath Soni, Director of izmo Microsystems Pvt Ltd, emphasised that high-frequency RF devices require semiconductor packages designed as integral parts of RF systems.

He explained that the company developed the package around specific electrical and application requirements and completed the entire process through to production. He confirmed that production shipments have begun and that the company has the manufacturing capability to scale as requirements expand.

The company also noted that the government’s SEMICON 2.0 program could provide further support to the domestic packaging ecosystem. With an approved outlay of ₹1,27,500 crore, the program includes strengthening the Assembly, Testing, Marking and Packaging (ATMP) and Outsourced Semiconductor Assembly and Test (OSAT) industry.

This initiative is expected to accelerate India’s semiconductor packaging capabilities and reduce reliance on foreign suppliers.

izmo Microsystems offers package and process development, prototyping, qualification, and manufacturing services. Based in Bangalore, the company specialises in System-in-Package, advanced IC packaging, and high-reliability electronics. Its work spans defence and aerospace, telecommunications, industrial electronics, automotive, medical electronics, and optical communications, positioning it as a key contributor to India’s semiconductor and defence technology ecosystem.

Agencies