India has approved 12 additional projects under the ₹40,000 crore Electronics Component Manufacturing Scheme (ECMS), further accelerating the country's efforts to strengthen domestic electronics production and reduce reliance on imports, announced PIB.

With the latest approvals, the total number of projects sanctioned under the scheme has reached 118. The newly approved investments are expected to generate production valued at approximately ₹39,045 crore while creating 7,127 direct employment opportunities across multiple regions of the country.

According to the Ministry of Electronics and Information Technology (MeitY), the approved projects are distributed across Gujarat, Karnataka, Madhya Pradesh, Maharashtra, Punjab, Tamil Nadu and Uttar Pradesh. The wide geographical spread highlights the government's intention to develop a broad-based electronics manufacturing ecosystem rather than concentrating investment in a limited number of industrial hubs.

The projects cover the production of several critical electronic components and materials that are essential to modern manufacturing supply chains. These include copper foil, cathode active materials, speciality ceramics, multilayer printed circuit boards (PCBs), relays and heat sinks.

The latest approvals form part of a wider national strategy aimed at deepening local value addition in electronics manufacturing. By encouraging domestic production of key components, India is seeking to build a more resilient supply chain while enhancing its competitiveness in global electronics markets.

Alongside the project approvals, Union Electronics and IT Minister Ashwini Vaishnaw announced the launch of the application portal for India Semiconductor Mission (ISM) 2.0, widely referred to as SEMICON 2.0.

The ambitious initiative has been allocated ₹1.27 lakh crore and is designed to strengthen India's semiconductor capabilities across the entire value chain. The program focuses on six strategic areas, including semiconductor design, equipment and materials, fabrication facilities, packaging operations, research and development, and talent development.

Under ISM 2.0, applications are being invited from companies interested in establishing semiconductor equipment and materials units, new semiconductor fabrication facilities, semiconductor assembly, testing, marking and packaging (ATMP) plants, as well as outsourced semiconductor assembly and testing (OSAT) operations.

Emphasising the government's commitment to attracting credible industry participants, Ashwini Vaishnaw stated that only fully complete applications would be considered under ISM 2.0. He said the government will consider only "fully complete applications", a measure intended to ensure participation from serious investors and industry stakeholders.

The combined impact of the latest ECMS approvals and the launch of the SEMICON 2.0 portal is expected to reinforce India's long-term ambition of becoming a major global electronics and semiconductor manufacturing destination.

The initiatives are intended to strengthen domestic supply chains, encourage high-value manufacturing, generate skilled employment and support technological self-reliance in strategically important sectors.

As global companies continue to diversify supply chains and seek alternative manufacturing destinations, India is positioning itself to capture a larger share of electronics and semiconductor investment through targeted incentives, infrastructure development and policy support.

PIB